Supermicro made its name in the industry by introducing the broadest portfolio of the high-performing, reliable servers fast to the market, packing the latest technologies into hyper-dense but highly versatile form factors for desired workloads. With Supermicro A+ product family supporting AMD 3rd and 2nd Gen EPYC™ processors, we took it a step further. Our building block solutions provide unparalleled performance and cost-efficiency through the exceptionally configurable, dense systems deployable at any scale. The A+ Multi-Node Servers feature single or dual AMD EPYC™ processors up to 128 cores and 256 threads per node, advanced thermal designs, full utilization of the latest PCI-E 4.0 lanes with flexible I/O capabilities up to 200G HDR InfiniBand networking, and the latest NVMe storage capability, .

• Scalable multi-node servers customizable from cloud and enterprise datacenter to demanding HCI and HPC environment, through hyper-dense design with flexible I/O options with hot-swappable drives and nodes.
• A+ multi-node products pack more punch per cubic inch with better and faster compute, higher core density, storage, and networking.
• The cost-effective Twin servers and SuperBlade solutions feature single or dual AMD EPYC™ processors up to 128 cores, 256 threads, 128 PCI-E 4.0 lanes per node with shared power and cooling design.

Designed for the most demanding workloads the A+ BigTwin server supports four nodes, each with dual AMD EPYC™ 7002 or 7003 Series processors for up to 128 cores and 256 threads per node — up to 512 cores per server — and up to 4 TB of DDR4-3200 memory.

The newest of Supermicro multi-node systems, the A+ FatTwin™ server family supports up to eight AMD EPYC™ processor-powered servers in only four rack units. This family strikes a new balance of compute power, storage capacity, and data center accessibility in a multi-node form factor.

Supermicro SuperBlade®, now with AMD EPYC™ 7003 Processors with AMD 3D V-Cache™ technology features 20 hot-pluggable blade servers, integrated 200G HDR InfiniBand switch, and up to 4x 25GbE switches or pass-thru modules. With shared cooling, power and networking infrastructure, this high performance, density optimized and energy-efficient SuperBlade® can significantly reduce e-waste,  initial capital, and operational expenses for many organizations.

The SuperBlade® has achieved back-to-back world record for the SPECjbb 2015-Distributed critical-jOPS and max-jOPS benchmark, with up to a 17% improvement using AMD EPYC 7003 Processors with AMD 3D V-Cache technology over AMD EPYC 7003 Processors without AMD 3D V-Cache technology, which is a significant boost to satisfy performance-hungry technical computing and enterprise workloads such as EDA, CFD and FEA

Supporting the complete 2nd and 3rd Gen AMD EPYC™ 7002/7003 series processor lineup, with up to 64 cores and 280W TDP per node, the single processor per node with the high core density keeps the cost low for large scale datacenter and HPC applications.