Supermicro H15 SP7 Multi-Node systems are designed to maximize compute density and operational efficiency by consolidating multiple server nodes within a shared chassis. Built on the latest AMD EPYC™ platforms, these systems enable scalable performance while optimizing power, cooling, and physical footprint.

With architectures tailored for both traditional and open rack environments, the H15 Multi-Node portfolio supports a wide range of scale-out workloads across modern data centers.
Back to H15 SP7 Portfolio
Explore H15 SP8 Systems
Select a Multi-Node Platform
High-Density Multi-Node Platforms for Scalable Infrastructure
H15 SP7 Multi-Node Systems
Multi-node systems enable greater infrastructure efficiency by consolidating compute resources while maintaining performance across demanding workloads.
Open rack–optimized multi-node systems designed for hyperscale environments requiring maximum efficiency and standardized deployment
FlexTwin (ORv3) Systems
Balanced multi-node architecture delivering high compute density with flexible configuration options for scalable deployments
GrandTwin
Systems
SP7 MultiNode Systems
Back to H15 SP7 Portfolio
Explore H15 SP8 Systems
View Details
Configuration focused on expanded storage and I/O flexibility for demanding enterprise and cloud environments
AS -2117GT7-HNR
View Details
Balanced multi-node platform designed for general-purpose compute and scalable infrastructure deployments
AS -2117GT7-HNF
View Details
Optimized for high-performance storage configurations with flexible NVMe support for data-intensive workloads
AS -2117GT7-DNF
Featured Product Lines
Consolidated infrastructure helps reduce footprint, power usage, and overall system cost
Improved Total Cost of Ownership
Ideal for cloud computing, virtualization, and distributed applications
Optimized for Scale-Out Workloads
Enables independent configuration and scaling of each node within the system
Scalable Node-Level Flexibility
Shared power and cooling infrastructure reduces energy consumption and operational overhead
Efficient Resource Sharing
Multiple independent server nodes within a shared chassis to maximize compute per rack
High-Density Multi-Node Architecture
Key Capabilities:
Shared redundant power supplies designed for multi-node efficiency and high-density deployment (Titanium Level)
Power Supply
Integrated high-speed networking per node with additional expansion options
Networking & I/O
Supports multiple NVMe/SATA drive configurations per node depending on system design
Drive Bays
Node-level management with support for centralized system monitoring and deployment
System Management
Up to 2–4 PCIe slots per node depending on configuration
Expansion
Up to 16 DIMMs per node supporting DDR5 memory
Memory
Supports single AMD EPYC™ SP7 processor per node
Processors
2U and 4U multi-node chassis configurations
Form Factor
Featured System Specs:
Download Datasheet
Supermicro H15 SP7 GrandTwin systems are designed to deliver high compute density and efficiency by integrating multiple independent server nodes within a shared chassis. Built to support the latest AMD EPYC™ SP7 processors, these systems enable scalable performance across cloud, enterprise, and high-performance computing environments.

By consolidating power, cooling, and infrastructure resources, GrandTwin platforms reduce total cost of ownership while maintaining flexibility at the node level—making them ideal for scale-out workloads and high-density deployments.
High-Density Multi-Node Performance for Scalable Workloads
H15 SP7 GrandTwin Systems
Placeholder
Open Image
SP7 MultiNode Systems
Back to H15 SP7 Portfolio
Explore H15 SP8 Systems
View Details
Single-socket system designed for efficient, standardized cloud deployments
AS -1127FT7-DEO-ALC
Featured Product Lines
Shared infrastructure reduces footprint, energy consumption, and operational complexity
Efficient Resource Consolidation
Enables consistent system configurations across large-scale infrastructure environments
Standardized Hyperscale Deployment
Designed for efficient power delivery and advanced cooling within ORv3 architectures
Optimized Power and Thermal Efficiency
Multiple nodes within a shared chassis to maximize compute per rack
High-Density, Scalable Compute
Built for next-generation open rack environments with standardized deployment and integration
Open Rack (ORV3) Multi-Node Design
Key Capabilities:
Open rack power architecture designed for high-efficiency power delivery within ORv3 environments
Power Supply
Supports high-speed networking optimized for hyperscale and open rack environments
Networking & I/O
Supports NVMe/SATA configurations per node depending on system design
Drive Bays
Centralized system management with support for large-scale deployment and monitoring
System Management
Up to 2 PCIe expansion slots per node depending on configuration
Expansion
Up to 16 DIMMs per node supporting DDR5 memory
Memory
Supports AMD EPYC™ SP7 processors per node
Processors
Open rack multi-node chassis aligned to ORv3 specifications
Form Factor
Featured System Specs:
Download Datasheet
Supermicro H15 SP7 FlexTwin (ORV3) systems are purpose-built for hyperscale data center environments that require standardized, high-density compute within open rack architectures. Designed to align with Open Rack V3 (ORv3) specifications, these systems enable efficient power distribution, optimized thermal performance, and streamlined deployment at scale. Supporting the latest AMD EPYC™ SP7 processors, FlexTwin (ORV3) platforms deliver consistent, scalable performance across distributed environments while maximizing efficiency through shared infrastructure and standardized system design.
Open Rack Multi-Node Systems for Hyperscale Efficiency
H15 SP7 FlexTwin (ORV3) Systems
Placeholder
Open Image