H14 GrandTwin - Supermicro H14 & H13 Servers

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AS-2116GT-HNTF

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Featured Product Lines

Form Factor

1U rackmount

2 PCIe 5.0 x16 FHHL

Expansion Slots

Up to 12 hot-swap 2.5" NVMe/SAS/SATA drive bays

2 M.2 slots

Storage

Redundant up to 2000W Titanium Level M-CRPS

Shared Power

-1 RJ45 dedicated IPMI management port
- 2 USB 3.0 ports with USB 2.0 speed
- 1 USB 3.0 port with display port support
- ASPEED AST2600 BMC graphics

I/O Ports

Single SP5 socket for AMD EPYC™ 9004 or 9005 Series processors, including those with AMD 3D V-Cache™ technology, up to 192 cores, up to 500W TDP2

Processor Support

12 DIMM slots; speeds up to 6000MT/s with up to 9TB

Memory Slots & Capacity

Featured System Specs

You can configure nodes to meet your HPC needs. For example with an InfiniBand card in the front-panel-accessible PCIe 5.0 slot and 100 Gigabit Ethernet in the rear AIOM/OCP 3.0 slot. The system can be equipped with up to two front-panel E1.S drives and two internal M.2 drives.

Power Your HPC Workloads

Regardless of your data center’s management approach, our open management APIs and tools are ready to support you. In addition to a dedicated IPMI port, and a Web IPMI interface per node, Supermicro® SuperCloud Composer software helps you configure, maintain, and monitor all of your systems using single-pane-of-glass management. If your DevOps teams prefer to use their own tools, industry-standard Redfish® APIs provide access to higher-level tools and scripting languages.

Open Management

Cloud data centers are all about scale, with a constant flow of new servers that scale capacity to new heights and also refresh existing infrastructure. The system’s DC-MHS compliance gives you the capability to easily interchange components, or repair failures, without the need for tools other than for the motherboard. The front-panel-accessible drives and their brackets are hot swappable and require no tools. Rear-panel components including power supplies, PCIe devices, and AIOM cards are all tool-less. The chassis lid can be opened by hand and the DC-MHS mid-chassis fans pop out for replacement.

Modular, Tool-Less Design

A single AMD EPYC processor gives you a no-compromise single-socket system, delivering the core density that once required two processors to achieve. With AMD you get more cores per dollar, more virtual instances on a server, and more subscribers in your data center. The CPU’s 128 lanes of PCIe 5.0 connectivity eliminates the need to scale up computing power just to accommodate more I/O bandwidth. The system-on-chip nature of the processor eliminates the need for external chip sets that contribute to design complexity and power consumption. Best of all, you only need to purchase and power a single processor for a high-performing, highly configurable system.

Designed for AMD EPYC Processors

The A+ Server 2116GT-HNTF has all storage and I/O accessible from the front panel. Each node supports up to four U.2 NVMe or SATA drives and a front I/O card with options including dual 10 or 25 Gigabit Ethernet, or single 100 Gigabit Ethernet interfaces.

For even more demanding network needs, the left pair of drive bays can be interchanged for a Supermicro Advanced I/O Module (AIOM) cage that supports OCP 3.0 interfaces.

GrandTwin Front I/O Node

This Supermicro multi-node system is designed for applications that need a large number of discrete servers with high-speed interconnects for networked or clustered operations. They are ideal for virtualized and nonvirtualized applications including:

Hyperconverged infrastructure and scale-out storage applications where a balanced set of resources is key
High-performance computing including EDA simulation, computational fluid dynamics, and weather modeling
Content-delivery networks where a large number of network streams need to run in parallel
Back-end infrastructure for mobile devices including gaming, voice recognition, and mapping services
Cloud computing where a large number of cores are needed to deliver high performance to each virtual machines
Big data analytics that combine scale-out storage with the need for high compute capacity for data analysis

These 2U servers optimize compute, memory, and I/O resources to deliver maximum density—four single-socket nodes in only two rack units. In this front-I/O system, all storage, networking, and node trays are accessible from the cold aisle, simplifying installation and servicing in space-constrained environments.

Each of the four nodes host a single AMD EPYC 9005 or 9004 Series CPU with up to 192 cores, up to 16 DIMMs for a total of 6 TB of DDR5-6000 memory (with EPYC 9005 Series), up to four U.2 NVMe or SATA drives with PCIe 5.0 connectivity, two M.2 slots for boot drives, and a range of networking options to keep data flowing freely through these powerful servers. Dual redundant 2200W power supplies economize on power and cooling.

Modular Multi-node System with Front I/O

System Highlights

2U, 4-Node-Per-Chassis Flexible Architecture

Maximize resource savings through shared power and cooling

AMD EPYC™ 9005 or 9004 Series processor with up to 6 TB of DDR5-6000 memory per node
Up to four 2.5" NVMe or SATA drives per node
PCIe 5.0 with CXL 2.0 support
Front I/O configuration enables field service from cold aisle to help reduce downtime
Flexible networking options with PCIe 5.0 OCP 3.0 interfaces
Redundant Titanium level shared power supplies

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CDN
HPC

EDA
Cloud

Key Applications:

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Designed for maximum density, the GrandTwin™ server is built on a multi-node architecture for to exploit the performance of 4th and 5th Gen AMD EPYC processors for high single-CPU performance. The H14 update to the GrandTwin design includes the capability to support up to 160 cores in EPYC 9005 Series processors, higher thermal capability, and an optional PCIe 5.0 x16 AOIM slot. The GrandTwin system delivers high performance in a modular design that can be optimized for a wide range of options, with the capability to add or remove components as needed to match data center needs.

Leading Multi-node Architecture with Front or Rear I/O

H14 GrandTwin® Systems